Research Area

Surface Technology

Sputter Technology

In the department of Surface Technology, two self-assembled sputtering systems are available. Both systems are equipped with rotatable and heatable substrate holder holders of 4" diameter for coating planar components. More complex 3D components on request!



System parameters:

  • DC controls with up to 1kW power input
  • R.f. Sputtering on request
  • Reactive and non-reactive sputtering possible
  • substrate temperatures up to approx. 700 °C
  • Flange and control for sample heating and rotation by Createc GmbH
  • Existing targets: Ag, Al, Al2O3, Au, Ca, Ca10(OH)2(PO4)6, CaSO4, Cr, C, Cu, CuZn39Pb2 (Messing), Fe, ITO, MO, Nb, NiCr20, Si, SiO2 (SQ1), Si3N4, Sn, Ta, Ti, TiO2, W, V, Zn, ZnSe, Zr

Overview of the Devices

Dr. Andreas Pfuch

Surface Technology
Team Leader
Physical Technologies

Phone: +49 3641 282554