from and about INNOVENT

INNOVENT at the Bondexpo

From 05 to 08 October INNOVENT e.V. presents itself at the international trade fair for bonding technology - Bondexpo in Stuttgart.

Bondexpo is the world's leading industry and user platform in the field of joining and bonding. The focus of Bondexpo is on joining/bonding by means of gluing, moulding, sealing and foaming as well as current and future challenges in these fields.

We welcome you in hall 5 at our booth 5402. Our focus is on the latest research and developments in the field of primers and chemical surface treatment.


We are looking forward to see you there!