INNOVENT at the Bondexpo
Bondexpo is the world's leading industry and user platform in the field of joining and bonding. The focus of Bondexpo is on joining/bonding by means of gluing, moulding, sealing and foaming as well as current and future challenges in these fields.
We welcome you in hall 5 at our booth 5402. Our focus is on the latest research and developments in the field of primers and chemical surface treatment.
We are looking forward to see you there!